The federal Defense Advanced Research Projects Agency (DARPA) recognized this year’s team of UC Merced engineering students for its design of a device that cools high-powered electronics aboard military aircraft.
In the yearlong Field-Reversible Thermal Conductor (RevCon) Challenge, hosted by DARPA and the Office of Naval Research (ONR), the team of juniors and seniors took second place overall and won first-place honors for having the most comprehensive analysis.